RF and Microwave Microelectronics Packaging

Ken Kuang, Franklin Kim, Sean S. Cahill, “RF and Microwave Microelectronics Packaging�
Springer 2009 | ISBN-10: 1441909834 | 285 Pages | File type: PDF | 12,6 mb

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.


[Fast Download] RF and Microwave Microelectronics Packaging

Related eBooks:
Artificial Intelligence in the Age of Neural Networks and Brain Computing
Power Systems Resilience: Modeling, Analysis and Practice
Understanding Geometric Algebra for Electromagnetic Theory
Spectacular touch typing tips
Turned On: Science, Sex and Robots
Beyond-CMOS Technologies for Next Generation Computer Design
Integrated Circuit and System Design
Applications of Modern Rf Photonics
Fundamentals of Electric Circuits, 4th edition
Technology for Small and One-Person Libraries: A LITA Guide
Transmission Lines and Lumped Circuits: Fundamentals and Applications
Phase-Lock Basics (2nd edition)
Copyright Disclaimer:
This site does not store any files on its server. We only index and link to content provided by other sites. Please contact the content providers to delete copyright contents if any and email us, we'll remove relevant links or contents immediately.