RF and Microwave Microelectronics Packaging



Ken Kuang, Franklin Kim, Sean S. Cahill, “RF and Microwave Microelectronics Packaging�
Springer 2009 | ISBN-10: 1441909834 | 285 Pages | File type: PDF | 12,6 mb

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
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